|
 |
|
| Vision Inspector |
 |
| Vision Inspector Vi-4200/2201/1201 |
 |
| Vi-4200 |
 |
| Vi-1201 |
 |
| Typical defect of
visual inspenction |
|
 |
Inspects minute foreign objects and
defects of IC chips such as an LC driver IC, LED
or precision electronic parts. |
|
Selectable from two types: the Vi-2201,
a full-automatic type including automatic wafer transfer,
and the Vi-1201, a low-price manual-transfer type |
|
A high-speed inspection at a rate of
0.09 second (Vi-2201) or 0.3 second (Vi-1201) per
one field of view |
|
A combination of a newly-developed
algorithm for defect inspection and an optical system
with high sensitivity securely detect minute defects
even in complex circuits such as memory circuits. |
|
Inspects two or more number of chips
simultaneously as long as they are in the same field
of view. (Up to 144 chips) |
|
A special optical system for detection
implements an optimal resolution and greater depth
of focus. |
|
One single unit supports both bare
wafers up to 200 mm and wafers up to 200 mm with
film carriers |
|
<Major specifications>
| |
Vi-2201 |
Vi-1201 |
| Inspecting
magnification |
5 X
(selectable) |
| Detectable
defect size |
5 microns or
greater
(with the inspecting magnification of 5 X ) |
| Inspecting
field of view |
2.5 mm X 3 mm |
| Inspecting
time |
0.09 sec / one field of view |
0.3 sec / one field of view |
| Available
size |
Wafer:
100/125/150/200 mm
Wafer with a film carrier:
100/125/150/200 mm |
Wafer:
50/76/100/125/150/200 mm
Wafer with a film carrier:
230 mm dia. or less |
| Floor space
to be occupied |
1,580 mm (W) X 1,030 mm (D) |
900 mm (W) X 1,296 mm (D)
(The monitor is separately installed.) |
| Option |
Printer, ink
maker, UPS, etc. |
|
